Zhang, K., & Yizhong, H. (2016). Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization.
استشهاد بنمط شيكاغوZhang, Keran, و Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.
MLA استشهادZhang, Keran, و Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.