APA引文

Zhang, K., & Yizhong, H. (2016). Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization.

Chicago Style Citation

Zhang, Keran, and Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.

MLA引文

Zhang, Keran, and Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.

警告：這些引文格式不一定是100％准確.