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  ______   __   __               ___      _____   
 /_____//  \ \\/ //     ___     / _ \\   / ____|| 
 `____ `    \ ` //     /   ||  / //\ \\ / //---`' 
 /___//      | ||     | [] || |  ___  ||\ \\___   
 `__ `       |_||      \__ || |_||  |_|| \_____|| 
 /_//        `-`'       -|_|| `-`   `-`   `----`  
 `-`                     `-`

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Text this: Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization