Yeo, S. H., & Kun, Z. (2017). Mechanical characterization and analysis of thin-film stacked structures for microelectronic assembly.
استشهاد بنمط شيكاغوYeo, Swain Hong, و Zhou Kun. Mechanical Characterization and Analysis of Thin-film Stacked Structures for Microelectronic Assembly. 2017.
MLA استشهادYeo, Swain Hong, و Zhou Kun. Mechanical Characterization and Analysis of Thin-film Stacked Structures for Microelectronic Assembly. 2017.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.