APA引文

Yeo, S. H., & Kun, Z. (2017). Mechanical characterization and analysis of thin-film stacked structures for microelectronic assembly.

Chicago Style Citation

Yeo, Swain Hong, and Zhou Kun. Mechanical Characterization and Analysis of Thin-film Stacked Structures for Microelectronic Assembly. 2017.

MLA引文

Yeo, Swain Hong, and Zhou Kun. Mechanical Characterization and Analysis of Thin-film Stacked Structures for Microelectronic Assembly. 2017.

警告：這些引文格式不一定是100％准確.