APA引文

Eason, K., Radhakrishnan, R. K., Shafiee, S. S., Elidrissi, M. R., Wang, H. T., Chan, K. S., . . . Engineering, S. o. E. a. E. (2013). Application of the grain flipping probability model to heat assisted magnetic recording.

Chicago Style Citation

Eason, Kwaku, Rathna Kumar Radhakrishnan, Sari Shafidah Shafiee, Moulay Rachid Elidrissi, Hong Tao Wang, Kheong Sann Chan, Yong Liang Guan, and School of Electrical and Electronic Engineering. Application of the Grain Flipping Probability Model to Heat Assisted Magnetic Recording. 2013.

MLA引文

Eason, Kwaku, et al. Application of the Grain Flipping Probability Model to Heat Assisted Magnetic Recording. 2013.