APA引文

Yap, C. C., Brun, C., Tan, D., Li, H., Teo, E. H. T., Baillargeat, D., . . . Engineering, S. o. E. a. E. (2013). Carbon nanotube bumps for the flip chip packaging system.

Chicago Style Citation

Yap, Chin Chong, Christophe Brun, Dunlin Tan, Hong Li, Edwin Hang Tong Teo, Dominique Baillargeat, Beng Kang Tay, and School of Electrical and Electronic Engineering. Carbon Nanotube Bumps for the Flip Chip Packaging System. 2013.

MLA引文

Yap, Chin Chong, et al. Carbon Nanotube Bumps for the Flip Chip Packaging System. 2013.