APA استشهاد

Chua, G. L., Singh, P., Soon, B. W., Liang, Y. S., Jayaraman, K. G., Singh, N., . . . Engineering, S. o. E. a. E. (2015). Molecular adhesion controlled microelectromechanical memory device for harsh environment data storage.

استشهاد بنمط شيكاغو

Chua, Geng Li, Pushpapraj Singh, Bo Woon Soon, Ying Shun Liang, Karthik Gopal Jayaraman, Navab Singh, Tony Tae-Hyoung Kim, و School of Electrical and Electronic Engineering. Molecular Adhesion Controlled Microelectromechanical Memory Device for Harsh Environment Data Storage. 2015.

MLA استشهاد

Chua, Geng Li, et al. Molecular Adhesion Controlled Microelectromechanical Memory Device for Harsh Environment Data Storage. 2015.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.