Chua, G. L., Singh, P., Soon, B. W., Liang, Y. S., Jayaraman, K. G., Singh, N., . . . Engineering, S. o. E. a. E. (2015). Molecular adhesion controlled microelectromechanical memory device for harsh environment data storage.
استشهاد بنمط شيكاغوChua, Geng Li, Pushpapraj Singh, Bo Woon Soon, Ying Shun Liang, Karthik Gopal Jayaraman, Navab Singh, Tony Tae-Hyoung Kim, و School of Electrical and Electronic Engineering. Molecular Adhesion Controlled Microelectromechanical Memory Device for Harsh Environment Data Storage. 2015.
MLA استشهادChua, Geng Li, et al. Molecular Adhesion Controlled Microelectromechanical Memory Device for Harsh Environment Data Storage. 2015.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.