أرسل هذا في رسالة قصيرة: Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties

 _    _    __   __   _    _    _    _    _    _   
| || | ||  \ \\/ // | |  | || | || | || | || | || 
| || | ||   \ ` //  | |/\| || | || | || | || | || 
| \\_/ ||    | ||   |  /\  || | \\_/ || | \\_/ || 
 \____//     |_||   |_// \_||  \____//   \____//  
  `---`      `-`'   `-`   `-`   `---`     `---`