APA引文

Wang, Z., Dong, H., Zou, Y., Zhao, Q., Tan, J., Liu, J., . . . Engineering, S. o. M. S. &. (2017). Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors.

Chicago Style Citation

Wang, Zongrui, et al. Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement Toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors. 2017.

MLA引文

Wang, Zongrui, et al. Soft-Etching Copper and Silver Electrodes for Significant Device Performance Improvement Toward Facile, Cost-Effective, Bottom-Contacted, Organic Field-Effect Transistors. 2017.