Yu, H., Shi, Y., He, L., Karnik, T., & Engineering, S. o. E. a. E. (2010). Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power.
استشهاد بنمط شيكاغوYu, Hao, Yiyu Shi, Lei He, Tanay Karnik, و School of Electrical and Electronic Engineering. Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. 2010.
MLA استشهادYu, Hao, et al. Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. 2010.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.