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  _____     ______    _____      ___     _____    
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| // __     -| ||-  / //---`'  | / \ || | |  \ || 
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 \____//   /_____//  \_____||   \___//  |_____//  
  `---`    `-----`    `----`    `---`    -----`

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Text this: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization