APA استشهاد

Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Z., Mhaisalkar, S. G., . . . Engineering, S. o. M. S. &. (2012). Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects.

استشهاد بنمط شيكاغو

Shao, W., Z. Chen, K. N. Tu, A. M. Gusak, Zhenghao Gan, Subodh Gautam Mhaisalkar, Hong Yu Li, و School of Materials Science & Engineering. Reservoir Effect and the Role of Low Current Density Regions On Electromigration Lifetimes in Copper Interconnects. 2012.

MLA استشهاد

Shao, W., et al. Reservoir Effect and the Role of Low Current Density Regions On Electromigration Lifetimes in Copper Interconnects. 2012.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.