Kumar, A., Chen, Z., Mhaisalkar, S. G., Wong, C. C., Teo, P. S., Kripesh, V., & Engineering, S. o. M. S. &. (2013). Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate.

Kumar, Aditya, Zhong Chen, Subodh Gautam Mhaisalkar, Chee Cheong Wong, Poi Siong Teo, Vaidhyanathan Kripesh, and School of Materials Science & Engineering. Effect of Ni–P Thickness On Solid-state Interfacial Reactions between Sn–3.5Ag Solder and Electroless Ni–P Metallization On Cu Substrate. 2013.

Kumar, Aditya, et al. Effect of Ni–P Thickness On Solid-state Interfacial Reactions between Sn–3.5Ag Solder and Electroless Ni–P Metallization On Cu Substrate. 2013.