Qi, G., Chen, Z., He, M., Kumar, A., & Engineering, S. o. M. S. &. (2013). Effect of interfacial reaction on the tensile strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P solder joints.
استشهاد بنمط شيكاغوQi, Guojun, Z. Chen, M. He, A. Kumar, و School of Materials Science & Engineering. Effect of Interfacial Reaction On the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints. 2013.
MLA استشهادQi, Guojun, et al. Effect of Interfacial Reaction On the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints. 2013.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.