Comparison of different molds (epoxy, polymer and silicon) for microfabrication by hot embossing technique

• المؤلفون الرئيسيون: Gupta, A., Tang, P. S., Jena, Rajeeb Kumar, Yue, Chee Yoon, Lam, Yee Cheong
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Mechanical engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/97844; http://hdl.handle.net/10220/12099

In the fabrication of microfluidic devices by hot embossing, secondary molds made from epoxy and other polymeric materials with high Tg are commonly used in lab-scale research and for short production runs of several hundred products. However, few studies have been conducted to compare the performan...