Distributed thermal-aware task scheduling for 3D network-on-chip

• المؤلفون الرئيسيون: Cui, Yingnan, Zhang, Wei, Yu, Hao
• مؤلفون آخرون: School of Computer Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/99911; http://hdl.handle.net/10220/12967
• المؤسسة: Nanyang Technological University

The development of 3D integration technology significantly improves the bandwidth of network-on-chip (NoC) system. However, the 3D technology-enabled high integration density also brings severe concerns of temperature increase, which may impair system reliability and degrade the performance. Task sc...