Liu, L., Yi, S., Ong, L., Chian, K., & LABORATORIES, T. (2014). Finite element analysis for microwave cure of underfill in flip chip packaging.
استشهاد بنمط شيكاغوLiu, L., S. Yi, L.S Ong, K.S Chian, و TEMASEK LABORATORIES. Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging. 2014.
MLA استشهادLiu, L., et al. Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.