APA Citation

Liu, L., Yi, S., Ong, L., Chian, K., & LABORATORIES, T. (2014). Finite element analysis for microwave cure of underfill in flip chip packaging.

Chicago Style Citation

Liu, L., S. Yi, L.S Ong, K.S Chian, and TEMASEK LABORATORIES. Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging. 2014.

MLA Citation

Liu, L., et al. Finite Element Analysis for Microwave Cure of Underfill in Flip Chip Packaging. 2014.

Warning: These citations may not always be 100% accurate.