發送短信 : Finite element analysis for microwave cure of underfill in flip chip packaging

  ______   _    _    _    _     ______   _    _   
 /_   _// | || | || | \  / ||  /_   _// | |  | || 
   | ||   | || | || |  \/  ||   -| ||-  | |/\| || 
  _| ||   | \\_/ || | .  . ||   _| ||_  |  /\  || 
 /__//     \____//  |_|\/|_||  /_____// |_// \_|| 
 `--`       `---`   `-`  `-`   `-----`  `-`   `-`