HAQUE, T., & ENGINEERING, M. (2010). Modeling and characterization of abrasive-free copper chemical mechanical planarization process.
Chicago Style CitationHAQUE, TABASSUMUL, and MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.
MLA CitationHAQUE, TABASSUMUL, and MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.
Warning: These citations may not always be 100% accurate.