HAQUE, T., & ENGINEERING, M. (2010). Modeling and characterization of abrasive-free copper chemical mechanical planarization process.
استشهاد بنمط شيكاغوHAQUE, TABASSUMUL, و MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.
MLA استشهادHAQUE, TABASSUMUL, و MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.