APA引文

HAQUE, T., & ENGINEERING, M. (2010). Modeling and characterization of abrasive-free copper chemical mechanical planarization process.

Chicago Style Citation

HAQUE, TABASSUMUL, and MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.

MLA引文

HAQUE, TABASSUMUL, and MECHANICAL ENGINEERING. Modeling and Characterization of Abrasive-free Copper Chemical Mechanical Planarization Process. 2010.

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