CHON, O. Y., & ENGINEERING, M. (2010). Static and dynamic flexure of PCBs in electronic packaging assemblies.
استشهاد بنمط شيكاغوCHON, ONG YEOW, و MECHANICAL ENGINEERING. Static and Dynamic Flexure of PCBs in Electronic Packaging Assemblies. 2010.
MLA استشهادCHON, ONG YEOW, و MECHANICAL ENGINEERING. Static and Dynamic Flexure of PCBs in Electronic Packaging Assemblies. 2010.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.