WONG, D. A., & ALLIANCE, S. (2019). Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps.
Chicago Style CitationWONG, DAVID ALLEN, and SINGAPORE-MIT ALLIANCE. Die-to-Die Interconnect Studies Using Copper Pillars With Tin-Silver Solder Bumps. 2019.
MLA CitationWONG, DAVID ALLEN, and SINGAPORE-MIT ALLIANCE. Die-to-Die Interconnect Studies Using Copper Pillars With Tin-Silver Solder Bumps. 2019.
Warning: These citations may not always be 100% accurate.