APA引文

WONG, D. A., & ALLIANCE, S. (2019). Die-to-Die Interconnect Studies using Copper Pillars with Tin-Silver Solder Bumps.

Chicago Style Citation

WONG, DAVID ALLEN, and SINGAPORE-MIT ALLIANCE. Die-to-Die Interconnect Studies Using Copper Pillars With Tin-Silver Solder Bumps. 2019.

MLA引文

WONG, DAVID ALLEN, and SINGAPORE-MIT ALLIANCE. Die-to-Die Interconnect Studies Using Copper Pillars With Tin-Silver Solder Bumps. 2019.

警告：這些引文格式不一定是100％准確.