LEONG, W. K., & ALLIANCE, S. (2019). STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT.
استشهاد بنمط شيكاغوLEONG, WONG KAH, و SINGAPORE-MIT ALLIANCE. STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT. 2019.
MLA استشهادLEONG, WONG KAH, و SINGAPORE-MIT ALLIANCE. STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT. 2019.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.