KANDASAMY, R., & ENGINEERING, M. (2010). PCM-based hybrid thermal management of electronic components.
استشهاد بنمط شيكاغوKANDASAMY, RAVI, و MECHANICAL ENGINEERING. PCM-based Hybrid Thermal Management of Electronic Components. 2010.
MLA استشهادKANDASAMY, RAVI, و MECHANICAL ENGINEERING. PCM-based Hybrid Thermal Management of Electronic Components. 2010.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.