APA引文

WEE, L. K., & ENGINEERING, M. (2019). THE ENCHANCED COOLING OF IC CHIP ARRAYS ON PRINTED CIRCUIT BOARDS (PCBS).

Chicago Style Citation

WEE, LOW KEK, and MECHANICAL ENGINEERING. THE ENCHANCED COOLING OF IC CHIP ARRAYS ON PRINTED CIRCUIT BOARDS (PCBS). 2019.

MLA引文

WEE, LOW KEK, and MECHANICAL ENGINEERING. THE ENCHANCED COOLING OF IC CHIP ARRAYS ON PRINTED CIRCUIT BOARDS (PCBS). 2019.

警告：這些引文格式不一定是100％准確.