APA引文

TAO, H., & ENGINEERING, M. (2010). Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers.

Chicago Style Citation

TAO, HE, and MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.

MLA引文

TAO, HE, and MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.

警告：這些引文格式不一定是100％准確.