TAO, H., & ENGINEERING, M. (2010). Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers.
استشهاد بنمط شيكاغوTAO, HE, و MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.
MLA استشهادTAO, HE, و MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.