APA Citation

TAO, H., & ENGINEERING, M. (2010). Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers.

Chicago Style Citation

TAO, HE, and MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.

MLA Citation

TAO, HE, and MECHANICAL ENGINEERING. Atomic Dynamics Model for Nanoscale Ductile Mode Cutting of Silicon Wafers. 2010.

Warning: These citations may not always be 100% accurate.