Wang, D., Wang, W., Huang, M., Lek, A., Lam, J., Mai, Z., & ENGINEERING, E. A. C. (2020). Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study.

Wang, D.D, W.L Wang, M.Y Huang, A. Lek, J. Lam, Z.H Mai, و ELECTRICAL AND COMPUTER ENGINEERING. Failure Mechanism Analysis and Process Improvement On Time-dependent Dielectric Breakdown of Cu/ultra-low-k Dielectric Based On Complementary Raman and FTIR Spectroscopy Study. 2020.

Wang, D.D, et al. Failure Mechanism Analysis and Process Improvement On Time-dependent Dielectric Breakdown of Cu/ultra-low-k Dielectric Based On Complementary Raman and FTIR Spectroscopy Study. 2020.