Lu, Y., Hong, M., Chan, D., Low, T., & ENGINEERING, E. (2014). Excimer laser applications in integrated circuit packaging.
استشهاد بنمط شيكاغوLu, Y.F., M.H Hong, D.S.H Chan, T.S Low, و ELECTRICAL ENGINEERING. Excimer Laser Applications in Integrated Circuit Packaging. 2014.
MLA استشهادLu, Y.F., et al. Excimer Laser Applications in Integrated Circuit Packaging. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.