Ong, E., Tay, A., Wu, J., & MICROELECTRONICS, I. O. (2014). Effect of delamination on the thermal fatigue of solder joints in flip chips.
استشهاد بنمط شيكاغوOng, E.T., A.A.O Tay, J.H Wu, و INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.
MLA استشهادOng, E.T., A.A.O Tay, J.H Wu, و INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.