Ong, E., Tay, A., Wu, J., & MICROELECTRONICS, I. O. (2014). Effect of delamination on the thermal fatigue of solder joints in flip chips.
Chicago Style CitationOng, E.T., A.A.O Tay, J.H Wu, and INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.
MLA CitationOng, E.T., A.A.O Tay, J.H Wu, and INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.
Warning: These citations may not always be 100% accurate.