APA引文

Ong, E., Tay, A., Wu, J., & MICROELECTRONICS, I. O. (2014). Effect of delamination on the thermal fatigue of solder joints in flip chips.

Chicago Style Citation

Ong, E.T., A.A.O Tay, J.H Wu, and INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.

MLA引文

Ong, E.T., A.A.O Tay, J.H Wu, and INSTITUTE OF MICROELECTRONICS. Effect of Delamination On the Thermal Fatigue of Solder Joints in Flip Chips. 2014.