APA引文

Teo, J., Chua, C., Koh, L., Phang, J., & ENGINEERING, E. &. C. (2014). Negative backside thermoreflectance modulation of microscale metal interconnects.

Chicago Style Citation

Teo, J.K.J., C.M Chua, L.S Koh, J.C.H Phang, and ELECTRICAL & COMPUTER ENGINEERING. Negative Backside Thermoreflectance Modulation of Microscale Metal Interconnects. 2014.

MLA引文

Teo, J.K.J., et al. Negative Backside Thermoreflectance Modulation of Microscale Metal Interconnects. 2014.