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             ___      _____     _____     ______  
  ____      / _ \\   |__  //   |  ___||  /_   _// 
 |    \\   | / \ ||    / //    | ||__    `-| |,-  
 | [] ||   | \_/ ||   / //__   | ||__      | ||   
 |  __//    \___//   /_____||  |_____||    |_||   
 |_|`-`     `---`    `-----`   `-----`     `-`'   
 `-`

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發送短信 : Finite element analysis of plastic-encapsulated Multi-Chip Packages