APA引文

Yeap, K., Zeng, K., Chi, D., & ENGINEERING, M. (2014). Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies.

Chicago Style Citation

Yeap, K.B., K. Zeng, D. Chi, and MECHANICAL ENGINEERING. Determining the Interfacial Toughness of Low-k Films On Si Substrate By Wedge Indentation: Further Studies. 2014.

MLA引文

Yeap, K.B., K. Zeng, D. Chi, and MECHANICAL ENGINEERING. Determining the Interfacial Toughness of Low-k Films On Si Substrate By Wedge Indentation: Further Studies. 2014.

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