Evelopment of novel lead-free solder composites using carbon nanotube reinforcements

10.1142/S0219581X0500367X

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Bibliographic Details
Main Authors:	Nai, S.M.L., Gupta, M., Wei, J.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Carbon nanotubes Composites Lead-free solder Mechanical properties
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60224
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Institution:	National University of Singapore

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