Tay, A., Lee, K., Lim, K., & ENGINEERING, M. (2014). Numerical simulation of delamination in IC packages using a new variable-order singular boundary element.
استشهاد بنمط شيكاغوTay, A.A.O., K.H Lee, K.M Lim, و MECHANICAL ENGINEERING. Numerical Simulation of Delamination in IC Packages Using a New Variable-order Singular Boundary Element. 2014.
MLA استشهادTay, A.A.O., K.H Lee, K.M Lim, و MECHANICAL ENGINEERING. Numerical Simulation of Delamination in IC Packages Using a New Variable-order Singular Boundary Element. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.