Text this: Numerical simulation of delamination in IC packages using a new variable-order singular boundary element

  _____      ___      ______    _____             
 |__  //    / _ \\   /_   _//  |  ___||     ___   
   / //    | / \ ||  `-| |,-   | ||__      /   || 
  / //__   | \_/ ||    | ||    | ||__     | [] || 
 /_____||   \___//     |_||    |_____||    \__ || 
 `-----`    `---`      `-`'    `-----`      -|_|| 
                                             `-`