Cai, M., Li, X., Rahman, M., & ENGINEERING, M. (2014). Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation.
Chicago Style CitationCai, M.B., X.P Li, M. Rahman, and MECHANICAL ENGINEERING. Study of the Mechanism of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation. 2014.
MLA引文Cai, M.B., X.P Li, M. Rahman, and MECHANICAL ENGINEERING. Study of the Mechanism of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation. 2014.
警告:這些引文格式不一定是100%准確.