Fiege, G., Feige, V., Phang, J., Maywald, M., Görlich, S., Balk, L., & ENGINEERING, E. (2014). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM).
Chicago Style CitationFiege, G.B.M., V. Feige, J.C.H Phang, M. Maywald, S. Görlich, L.J Balk, and ELECTRICAL ENGINEERING. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.
MLA CitationFiege, G.B.M., et al. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.
Warning: These citations may not always be 100% accurate.