Fiege, G., Feige, V., Phang, J., Maywald, M., Görlich, S., Balk, L., & ENGINEERING, E. (2014). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM).

Fiege, G.B.M., V. Feige, J.C.H Phang, M. Maywald, S. Görlich, L.J Balk, و ELECTRICAL ENGINEERING. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.

Fiege, G.B.M., et al. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.