APA引文

Fiege, G., Feige, V., Phang, J., Maywald, M., Görlich, S., Balk, L., & ENGINEERING, E. (2014). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM).

Chicago Style Citation

Fiege, G.B.M., V. Feige, J.C.H Phang, M. Maywald, S. Görlich, L.J Balk, and ELECTRICAL ENGINEERING. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.

MLA引文

Fiege, G.B.M., et al. Failure Analysis of Integrated Devices By Scanning Thermal Microscopy (SThM). 2014.