Ling, C., Kwok, C., Prasad, K., & ENGINEERING, E. (2014). SILICON NITRIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL VAPOUR DEPOSITION (PECVD) OF SiH//4/NH//3/N//2 MIXTURES: SOME PHYSICAL PROPERTIES.
Chicago Style CitationLing, C.H., C.Y Kwok, K. Prasad, and ELECTRICAL ENGINEERING. SILICON NITRIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL VAPOUR DEPOSITION (PECVD) OF SiH//4/NH//3/N//2 MIXTURES: SOME PHYSICAL PROPERTIES. 2014.
MLA引文Ling, C.H., C.Y Kwok, K. Prasad, and ELECTRICAL ENGINEERING. SILICON NITRIDE FILMS PREPARED BY PLASMA-ENHANCED CHEMICAL VAPOUR DEPOSITION (PECVD) OF SiH//4/NH//3/N//2 MIXTURES: SOME PHYSICAL PROPERTIES. 2014.
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