Yu, D., Lee, C., Lau, J., & ENGINEERING, E. &. C. (2014). The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding.
استشهاد بنمط شيكاغوYu, D., C. Lee, J.H Lau, و ELECTRICAL & COMPUTER ENGINEERING. The Role Ofni Buffer Layer between Insn Solder and Eu Metallization for Hermetic Wafer Bonding. 2014.
MLA استشهادYu, D., C. Lee, J.H Lau, و ELECTRICAL & COMPUTER ENGINEERING. The Role Ofni Buffer Layer between Insn Solder and Eu Metallization for Hermetic Wafer Bonding. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.