Text this: The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding

 _    _    _    _    _____      _____     _  __  
| \  / || | || | || |  __ \\   |  ___||  | |/ // 
|  \/  || | || | || | |  \ ||  | ||__    | ' //  
| .  . || | \\_/ || | |__/ ||  | ||__    | . \\  
|_|\/|_||  \____//  |_____//   |_____||  |_|\_\\ 
`-`  `-`    `---`    -----`    `-----`   `-` --`